Tambarin aluminum sheet karfe sassa

Tsarin oxygenation

Yawancin matakai ana haɗa su cikin tsarin oxidation:

1. Ciyarwar Raw: Yi amfani da bututu don samar da albarkatun ƙasa zuwa ga reactor domin kiyaye daidaitattun ma'auni na albarkatun ƙasa a ciki.
2. Reaction: Don aiwatar da aikin iskar oxygen, ƙara oxygen zuwa reactor kuma daidaita sigogin amsawa (kamar zazzabi, matsa lamba, da lokacin amsawa).
3. Rabuwar samfur: Yi amfani da na'urar sanyaya iska don sanyaya samfurin da aka amsa, juya shi daga yanayin gas zuwa ruwa ko sifa mai ƙarfi, sannan yi amfani da mai rarrabawa don raba samfuran da suka samo asali daga sassa daban-daban.
4. Tsarkakewa: Don tabbatar da cewa samfurin amsa ya kai ga tsarkin da ake bukata, tsarkake shi.
5. Marufi: Bayan an tsarkake samfuran, ana tattara su daidai da ƙa'idodi da ƙa'idodi kafin a sayar da su ga abokan ciniki ko a tura su zuwa mataki na gaba na sarrafawa.

A wasu takamaiman aikace-aikace, irin su sarrafa wafer semiconductor, tsarin iskar shaka kuma ya haɗa da samar da oxidants (kamar ruwa, oxygen) da makamashin thermal akan siliki don samar da fim ɗin silicon dioxide (SiO2).Wannan fim ɗin oxide yana kare wafer ta hanyar hana ɗigon ruwa daga gudana tsakanin da'irori, hana yaduwa a lokacin aikin dasa ion, da kuma yin aiki azaman fim ɗin anti-etching wanda ke hana kuskuren etching yayin aiwatar da etching.